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1/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. led drivers for lcd backlights white backlight led drivers for medium to large lcd panels (switching regulator type) bd6066gu, BD6066EKN description bd6066gu/BD6066EKN are white led driver ics with pw m step-up dc/dc converter that can boost max 40.5v and current driver that can driv e max 30ma. the wide brightness can be adjusted to control by external pwm pulse on power control terminal. and, with extended resolution current driver, a few errors between the lines of the current driver, it is sui table for decreasing the lacking in brightness of the display. bd 6066gu, csp package type, is suited for saving space. BD6066EKN, hqfn package type, is suited for mounting on the flexible board. features 1) high efficiency pwm step-up dc/dc converter (fsw=1mhz) 2) extended resolution current driver 4ch 3) driving 12 series 4parallel =48 white leds ( white led vf=3.2vmax) 4) wide input voltage range (2.7v ~ 22v) 5) rich safety functions ? over-voltage protection (ovp) ? over current limit ? external sbd open detect ? thermal shutdown (175 ) 6) csp small & thin package vcsp85h2 2.6 2.6 0.85mm hqfn28v 5.2 5.2 0.95mm applications notebook pc, portable dvd player, car navigation systems absolute maximum ratings (ta=25 ) parameter symbol limits unit condition maximum applied voltage 1 vmax1 7 v test,iset,vreg,sensp, sensn, sw, en1, en2, pwm maximum applied voltage 2 vmax2 15.5 v led1, led2, led3, led4 maximum applied voltage 3 vmax3 30.5 v vbat maximum applied voltage 4 vmax4 50.5 v vdet power dissipation 1 (bd6066gu) pd1 1100 *1 mw power dissipation 2 (BD6066EKN) pd2 560 *2 mw power dissipation 3 (BD6066EKN) pd3 880 *3 mw power dissipation 4 (BD6066EKN) pd4 2650 *4 mw operating temperature range topr -30 ~ +85 storage temperature range tstg -55 ~ +150 (*1) the measurement value which was mounted on the pcb by rohm. when it?s used by more than ta=25 , it?s reduced by 8.8mw/ . (*2) reduced 4.5mw/ with ta>25 when not mounted on a heat radiation board. (*3) 70mm x 70mm x 1.6mm glass epoxy board which has 1 layers (60mm x 60mm). when it?s used by more than ta=25 , it?s reduced by 7.0mw/ . (*4) 70mm x 70mm x 1.6mm glass epoxy board which has 2 layers (60mm x 60mm). when it?s used by more than ta=25 , it?s reduced by 21.2mw/ . no.11040ebt26
technical note 2/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn ? ?
technical note 3/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn reference data fig.1 current consumption - power source voltage fig.2 quiescent current - power source voltage fig.3 oscillation frequency - power source voltage fig.4 over voltage limit - power source voltage fig.5 sbd open protect limit - power source voltage fig.6 led terminal over voltage protect vs power source voltage fig.7 vreg - power source voltage fig.8 uvlo - temperature fig.9 over current limit voltage - temperature fig.11 led current - led terminal voltage fig.12 led current - power source voltage fig.10 led current - led terminal voltage ( expansion) 0 1 2 3 4 5 6 0 5 10 15 20 25 vbat[v] vreg[v] 19.0 19.2 19.4 19.6 19.8 20.0 20.2 20.4 20.6 20.8 21.0 0.20 0.40 0.60 0.80 1.00 1.20 1.40 vled[v] iled[ma] 25 -30 85 19.0 19.2 19.4 19.6 19.8 20.0 20.2 20.4 20.6 20.8 21.0 2345678910 vled[v] iled[ma] 25 -30 85 19.0 19.2 19.4 19.6 19.8 20.0 20.2 20.4 20.6 20.8 21.0 0 5 10 15 20 25 vbat[v] iled[ma] 25 -30 85 10 11 12 13 14 15 16 0 5 10 15 20 25 vbat[v] led[v] 25 -30 85 0 1 2 3 4 5 0 5 10 15 20 25 vbat [v] iin [ma] -30 25 85 0 5 10 15 20 0 5 10 15 20 25 vbat[v] ist[a] 25 -30 85 0.7 0.8 0.9 1 1.1 1.2 1.3 0 5 10 15 20 25 vbat [v] fr equency [mhz] -30 85 25 40 41 42 43 44 0 5 10 15 20 25 vbat[v] vdet[v] 25 -30 85 0 0.5 1 1.5 2 2.5 -50 - 25 0 25 50 75 100 ta [ o c] vbat [v] 0 50 100 150 200 -50 - 25 0 25 50 75 100 ta [ o c] over curr ent detected voltage [mv] 5v 2.7v, 3.1v, 6v 22v 0.0 0.1 0.2 0.3 0.4 0 5 10 15 20 25 vbat[v] vdet[v] -30, 25 85
technical note 4/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn output 10v/div coil current 500ma/div average current = 0.8ma fig.14 led current - pwm hi duty pwm = 200hz fig.13 efficiency - source voltage fig.15 led current - pwm hi duty( expansion) pwm = 200hz fig.16 led current - pwm hi duty pwm = 200hz fig.17 led current - pwm hi duty( expansion) pwm = 200hz fig.18 led current matching - pwm hi duty pwm = 200hz fig.19 led current matching - pwm hi duty (expansion) pwm = 200hz fig.20 led current matching - pwm hi duty vf dispersion of led line interval is 2.6v. pwm = 200hz fig.21 led current matching - pwm hi duty (expansion) vf dispersion of led line interval is 2.6v. pwm = 200hz fig.22 led open voltage 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 vbat[v] efficiency[%] -30 25 85 0 5 10 15 20 25 0 20406080100 pwm-hi duty [ ] led curr ent [ma] 6v, 7.4v, 10.7v, 22v 16v iset=27k ? 0 0.5 1 1.5 2 2 4 6 8 10 12 14 16 18 20 pwm-hi duty [ ] led curr ent [ma] 6v 16v 10.7v 7.4v 22v iset=27k ? 0 0.5 1 1.5 2 0 2 4 6 8 101214 161820 pwm-hi duty [%] led curr ent [ma] -30 25 85 vbat=7.4v iset=27k ? 0 5 10 15 20 25 0 2040 6080100 pwm-hi duty [%] led curr ent [ma] -30 25 85 vbat=7.4v iset=27k ? -10 0 10 20 30 40 50 60 70 80 90 100 0 20 40 60 80 100 pwm-hi duty [%] disper sion [%] vf dispersion of led line interval is 2.6v. vf dispersion of led line interval is small. vbat=7.4v iset=27k ? -10 0 10 20 30 40 50 0 5 10 15 20 25 30 duty [%] dispersion [%] vbat=7.4v iset=27k ? vf dispersion of led line interval is 2.6v. vf dispersion of led line interval is small. -10% 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 0 102030405060708090100 pwm-hi duty [%] disper sion 6v 7.4v 10.7v 16v 22v -10% 0% 10% 20% 30% 40% 50% 0 5 10 15 20 25 30 duty [%] disper sion 6v 7.4v 10.7v 16v 22v
technical note 5/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn block diagram, i/o equivalent circuit diagram pin assignment table pin name in/out pin number function terminal equivalent circuit diagram bd6066gu BD6066EKN sensn in a1 1 - side current sense terminal a gnd - a2 2 gnd b vdet in c3 3 detect input for sbd open and ovp c n.c. - - 4 no connect pin - n.c. - - 5 no connect pin - iset in a3 6 resistor connection for led current setting a test in a4 7 test input (pull down 100k ? to gnd) g n.c. - - 8 no connect pin - led4 in a5 9 current sink for led4 c led3 in b5 10 current sink for led3 c n.c. - - 11 no connect pin - led2 in c5 12 current sink for led2 c led1 in d5 13 current sink for led1 c n.c. - - 14 no connect pin - en1 in e5 15 enable input 1 e n.c. - - 16 no connect pin - en2 in e3 17 enable input 2 e n.c. - - 18 no connect pin - vbat in e4 19 battery input c vreg out e2 20 regu lator output / internal power-supply d pwm in e1 21 pwm input f n.c. - - 22 no connect pin - gnd - d1 23 gnd b n.c. - - 24 no connect pin - vreg out - 25 regulator outp ut / internal power-supply d sw out c1 26 switching tr drive terminal g sensp in b1 27 + side current sense terminal g gnd - - 28 gnd b fig.23 block diagram + + - osc control sence pwmcomp test pwm sensp sensn current sence s q r - + - + over voltage protect sbd open protect vin detecto r reg internal powe r supll y vdet sw uvlo en1 en2 current driver iset resistor driver + - - - led1 led2 led3 iset erramp led4 - gnd clump clump tsd led terminal over voltage protect vbat vreg gnd gnd vbat vreg pin a vbat pin b gnd pin c gnd vbat pin d gnd vbat pin e 5.5v clump gnd vbat pin f 5.5v clump vreg gnd vbat pin g vreg fig.24 i/o equivalent circuit diagram
technical note 6/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn application example fig.25 led current 20ma setting example fig.26 led current 20ma setting example (10 series 4parallel) (10 series 3parallel) fig.27 separated power supply of ic and coil setting example fig.28 over voltage 48.1v(typ) by external resistor, led current 20ma setting example (12 series (v f 3.6vmax) 4parallel) terminal processing test pin = connect to gnd n.c. = nothing specified in particular. open is recommended. vreg = when ic is driving from the outside of 3.1~5.5v, short vbat and vreg, and put the voltage to vreg en1, 2 = connect to gnd in case of fixing at l level led1, 2 = when each led driver are not used at en setting, connect to vreg terminal or the power supply of more than 1v. gnd = each gnd is connecting inside ic. connect to gnd of all pcb 10 f (25v) batter y vdet sw gnd led1 led2 led3 24k ? rb160m-60 4.7 h 10led test sensp sensn led4 c1 b1 a1 d1 a4 a3 d5 c5 b5 a5 c3 gnd a2 68m ? rtr020n05 2.2 f (50v) iset en1 en2 pwm e5 e3 e1 power on/off 200hz pwm vreg vbat 1 f(10v) e4 e2 3.1 to 5.5v each 20ma 10 f (25v) batter y vdet sw gnd led1 led2 led3 24k ? rb160m-60 4.7 h 12led test sensp sensn led4 c1 b1 a1 d1 a4 a3 d5 c5 b5 a5 c3 gnd a2 each 20ma 39m ? 2.2 f (100v) iset en1 en2 pwm e5 e3 e1 power on/off 200hz pwm vreg vbat 1 f(10v) e4 e2 270k ? 10 f (25v) battery vdet sw gnd led1 led2 led3 24k ? rb160m-60 4.7 h 10led test sensp sensn led4 c1 b1 a1 d1 a4 a3 d5 c5 b5 a5 c3 gnd a2 68m ? rtr020n05 2.2 f (50v) iset en1 en2 pwm e5 e3 e1 power on/off 200hz pwm vreg vbat 1 f(10v) e4 e2 each 20ma 10 f (25v) battery vdet sw gnd led1 led2 led3 24k ? rb160m-60 4.7 h 10led test sensp sensn led4 c1 b1 a1 d1 a4 a3 d5 c5 b5 a5 c3 gnd a2 68m ? rtr020n05 2.2 f (50v) iset en1 en2 pwm e5 e3 e1 power on/off 200hz pwm vreg vbat 1 f(10v) e4 e2 each 20ma
technical note 7/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn description of functions 1) pwm current mode dc/dc converter while bd6066gu/ekn is power on, the lowest voltage of led1, 2, 3, 4 is detected, pwm duty is decided to be 0.5v and output voltage is kept invariably. as for the inputs of the pwm comparator as the feature of the pwm cu rrent mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into slope waveform to prevent s ub harmonic oscillation. this out put controls external nch tr via the rs latch. in the period where external nch tr gate is on, energy is accumula ted in the external inductor, and in the period where external nch tr gate is off, energy is transfe rred to the output capacitor via external sbd. bd6066gu/ekn has many safety functions, and their detection signals stop switching operation at once. 2) soft start and off status bd6066gu/ekn has soft start func tion and off status function. the soft start function and the off status function prevent large coil current. rush current at turning on is prevented by the soft start func tion, and invalid current at turning off is prevented by the off status function. 3) external sbd open detect and over voltage protection bd6066gu/ekn has over boost pr otection by external sbd open and over voltage protection. this function will stop the switching. details are as shown below. ? external sbd open detect in the case of external sbd is not connec ted to ic, the coil or external tr may be destructed. therefore, at such an error as vout becoming 0.2v or below, the under detector shown in the figure works, and turns off the output tr, and prevents the coil and the ic from being destructed. and the ic changes from activation into non-activa tion, and current does not flow to the coil (0ma). ? over voltage protection at such an error of output open as t he output dc/dc and the led is not connected to ic, the dc/dc will boost too much and the vdet terminal exceed the absolute maximum ratings, and may destruct the ic. therefore, when vdet becomes sensing voltage or higher, the over voltage limit works, and turns off the output tr, and the pr essure up made stop. at this moment, the ic changes from activation into non-activation, and the output voltage goes down slowly. and, when the output voltage becomes the hysteresis of the over voltage limit or below, th e output voltage pressure up to sensing voltage once again and unless the application error is recovered, this operation is repeated. this protection action is shown in fig.29. 4) thermal shut down bd6066gu/ekn has thermal shut down function. the thermal shut down works at 175 ? c or higher, and while holding the setting of en control from the outside, the ic changes from activation into non-activation. and at 175 ? c or below, the ic gets back to its normal action. fig.29 block diagram of external sbd open detect and over voltage vdet over detector control sbd open detector over voltage ref sbd open voltage ref cout sw
technical note 8/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn 5) over current limit over current flows the current detection resistor that is connected to switch ing transistor source and between gnd, sensp pin voltage turns more than detection voltage, over current protection is operating and it is prevented from flowing more than detection current by reducing on duty of switching tr without stopping boost. as over current detector of bd6066gu/ekn is detected peak current, current more than over current setting value does not flow. and, over current value can decide freely by changing over current detection voltage. detection resistor =over current detecti on voltage / over current setting value typ value of over current detection voltage is 100mv, mi n = 70mv and max = 130mv and after the current value which was necessary for the normal operation was decided, detection re sistor is derived by using min value of over current detection value. for example, detection resistor when necessary current value was set at 1a is given as shown below. detection resistor =70mv / 1a = 70m ? max current dispersion of this detection resistor value is max current = 130mv / 70m ? = 1.86a as over current detector of bd6066gu/ekn is detected the peak current, it have to estimate peak current to flow to the coil by operating condition. in case of, su pply voltage of coil = vin reactance value of coil = l switching frequency = fsw min=0.8mhz, typ=1mhz, max=1.2mhz output voltage = vout total led current = iout average current of coil = iave peak current of coil = ipeak efficiency = eff (please set up having margin, it refers to data on p.4.) on time of switching transistor = ton ipeak = (vin / l) (1 / fsw) (1-(vin / vout)) iave=(vout iout / vin) / eff ton=(iave (1-vin/vout) (1/fsw) (l/vin) 2) 1/2 each current is calculated. as peak current varies according to whether there is the direct current superposed, the next is decided. (1-vin/vout) (1/fsw) < ton peak current = ipeak /2 + iave (1-vin/vout) (1/fsw) > ton peak current = ipeak (example 1) in case of, vin=6.5v, l=4.7h, fsw=1m hz, vout=39v, iout=80ma, efficiency=85% ipeak = (6.5v / 4.7h) (1 / 1mhz) (1-(6.5v / 39v)) =1.08a iave = (39v 80ma / 6.0v) / 85% = 0.61a ton = (0.61a (1-6.0v / 39v) (1 / 1mhz) ( 4.7h /6.0v) 2) 1/2 = 0.90s (1-vin/vout) (1 /fsw)=0.85s < ton peak current = 1.08a/2+0.61a = 1.15a (example 2) in case of, vin=12.0v, l=4.7h, fsw=1m hz, vout=39v, iout=80ma, efficiency=85% ipeak = (12.0v / 4.7h) (1 / 1mhz) (1-(12v / 39v)) =1.77a iave = (39v 80ma / 12.0v) / 85% = 0.31a ton = (0.31a (1-12 v / 39v) (1 / 1mhz) ( 4.7h /12 v) 2) 1/2 = 0.41s (1-vin/vout) (1 /fsw)=0.69s > ton peak current = 12v/4.7h 0.41s = 1.05a
technical note 9/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn start control and select constant current driver bd6066gu/ekn can control the start condi tions by en1, 2 terminal and pwm terminal, and sets 0.2v or below en1, 2 terminal or sets 0.2 or below pwm terminal and ic can power off by being 0v led terminal selected en1, 2. pwm, en power on at more than 1.4v, constant curre nt can select on/off by the combinatio n of en as shown below table. when there is unused constant current driver, connect unused led terminal to vreg terminal or connect to fixed voltage of more than 1v. and, en1, 2 are changed with pwm=h and it is prohibited to change a constant current driver. enable constant current driver en1 en2 pwm led1 led2 led3 led4 h h h off off on on l h h off on on on h l h on on on on l l h off (as for these setups, power-off ic.) h h l l h l h l l l l l off sequence off sequence controls power off timing of each block, led terminal may not exceed the pressure. after en or pwm terminal set h l, it continues electric current by the current value decided with iset terminal until all the led terminals selected with en are less than 40mv and output voltage reduces. on that occa sion, the dc/ dc power-off is given and it doesn't have a charge to the output capacitor. afte r that, led driver is turned off, built-in reg is turned off, a nd power-off is completed. if the vf tolerance of the led is lar ge, it doesn't need to examine vf not to exceed pressure of the led terminal by this sequence. reg_en led4 led3 led2 led1 sw ? led 10 lights ? ? ? led 9 lights terminal voltage is low terminal voltage is high reg 5v dcdc_en drv_en drv dcdc power control en1, 2,pwm fig.30 block diagram of off sequence en dcdc_en drv_en reg_en led terminal voltage is high. led terminal voltage is low. terminal voltage is detected, and turned off.
technical note 10/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn setting of led current and current range led current can set up resistance value (riset) connecting to iset, led current setting range is 4ma~30ma. setting of led current is given as shown below. led current = 20ma ( 24k ? / riset) the current in the standard application is as shown below. riset=24k ? , led current=20ma brightness control pwm brightness adjustment is made by inputting pwm pulse to pwm pin. the electric current select setting with iset in the hi section, and the lo section turns off the electric current. lo. the average current increases in proportion with the duty cycle of pwm signal. by this method, ic can power off at the off time, the ic and led both consume no currents, thus providing a high-efficiency operation. the recommended pwm frequency is 100hz ~ 300hz. on time is necessa ry more than 750 s (at the time of 200hz, 15%) to require the start up-time of 750 s. < off time limit > off time is approximated by the following parameter. external output capacitor : cvout led current setting : iled (worst = +5%) led sequence number : npled led series number : nsled vf tolerance of led terminal : ? vf reaction time of internal circuit : 10 s (worst = 15 s) necessary time for off (typ) = cvout (( ? vf nsled) + 0.5v)/(iled npled)+10 s (example) necessary time for off (typ) = 2 f ((0.2v 10 lights) + 0.5v)/(20ma 4)+10 s = 72.5 s please use worst value of each parameter when you calculate the worst time. (example) necessary time for off (worst) = (2 f 1.3) ((0.26v 10 lights) + 0.7v)/((20ma 1.05) 4)+15 s =117 s and please don?t use on time under 750 s or under off time calculated in the ab ove of current setting for the brightness control, because power-on/off has very influential. noise of ceramic capacitor by pwm brightness control in order to use a ceramic capacitor as the output capacitor, noise of capacitor occurs by the kind of the circuit board and mounted method, the mounting place. as for the noise cause, the resonant of ceramic capacito r and the board give cause by output voltage fluctuation. measures of this trouble are shown. (1) ceramic capacitor is changed to tantalum capacitor. by changing to tantalum capacitor, noise is stopped because of changing ceramic capacitor itself bringing about the noise. but, as the output ripple increases by esr that is characteristic of the tantalum, it needs to select tantalum with low esr. also, it recommends connecting parallel capacitor for the noise measure of 0.1f recommended capacitor is shown next page. (2) ceramic capacitor is floated from the top of the circuit board. reducing the contact surface of the ceramic capa citor and the circuit board can reduce the noise. capacitor that can float a capacitor from the circuit board are as shown below. this capacitor is connected the metal cap both electrodes of the capacitor, so it can have the effect which be floated because the metal cap is connected to the circuit board . recommended capacitor is shown next page. iset setting example riset led current 24.0 k ? (e24) 20.0ma 25.5 k ? (e96) 18.8ma 27.0 k ? (e12) 17.8ma 28.0 k ? (e96) 17.1ma 30.0 k ? (e24) 16.0ma 33.0 k ? (e6) 14.5ma the metal cap the circuit board ckg45nx7r2a225n (tdk) fig.31 the metal cap capacitor
technical note 11/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn selection of external parts recommended external parts are as shown below. when to use other parts than these, sele ct the following equivalent parts. coil value manufacturer product number size dc current (ma) dcr (? ) use power voltage range vertical horizontal height 4.7 h toko b1015as-4r7n 8.4 8. 3 4.0 3300 0.038 2.7 ~ 22v 4.7 h taiyo yuden nr4012t4r7m 4.0 4.0 1.2 960 0.14 2.7 ~ 22v 4.7 h taiyo yuden nr4018t4r7m 4.0 4.0 1.8 1200 0.11 2.7 ~ 22v 6.8 h taiyo yuden nr4012t6r8m 4.0 4.0 1.2 840 0.18 7.0 ~ 22v capacitor value pressure manufacturer product number size temperature range vertical horizontal height [ power supply capacitor ] 10 f 25v murata grm31cb31e106ka75 3.2 1.6 1.6 -25deg ~ +85deg [ smoothing capacitor fo r built-in regulator ] 1 f 10v murata grm188b10j105ka01 1.6 0.8 0.8 -25deg ~ +85deg [ output capacitor ] 1 f 50v murata grm31mb31h105ka87 3.2 1.6 1.15 -25deg ~ +85deg 2.2 f 50v murata grm31cb31h225ka87 3.2 1.6 1.6 -25deg ~ +85deg [ output capacitor ] noise measure 1 of ceramic capacitor (tantalum capacitor +0.1f) 0.1 f 50v murata grm188b31h104ka92 1.6 0.8 0.8 -25deg ~ +85deg 1.0 f 50v kyocera tajw105m050 6. 0 3.2 1.5 -55deg ~ +125deg 2.2 f 50v kyocera tajc225m050 6. 0 3.2 2.6 -55deg ~ +125deg [ output capacitor ] noise measure 2 of ceramic capacitor (capacitor with the metal cap) 2.2 f 100v tdk ckg45nx7r2a225n 5.5 4.0 5.5 -55deg ~ +125deg resistor value tolerance manufacturer product number size vertical horizontal height [ resistor for led current decision ] 24k ? 0.5% rohm mcr006yzpd243 0.6 0.3 0.23 [ resistor for over current decision ] 47m ? 1% rohm mcr10ezhflr047 2.0 1.25 0.55 sbd pressure manufacturer product number size vertical horizontal height 60v rohm rb160m-60 3.5 1.6 0.8 mos fet nch pressure manufacturer product number size current ability driving voltage vertical horizontal height 45v rohm rtr020n05 3. 5 1.6 0.8 2a 2.5v 60v rohm 2sk2503 9.5 6.5 2.3 5a 4.0v 60v fair child ndt3055l 6.5 7.0 1.8 4a 2.0v the coil is the part that is mo st influential to efficiency. select the coil wh ose direct current resist or (dcr) and current - inductance characteristic is excellent. bd6066gu/ekn are desi gned for the inductance value of 4.7h or 6.8h. do not use other inductance value. select a capacitor of ceramic type with excellent frequency and temperature characteristics. further, select capacitor to be used with small direct current re sistance, and pay sufficient attention to the pcb layout shown in the next page.
technical note 12/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn pcb layout in order to make the most of the performanc e of this ic, its pcb layout is very im portant. characteristics such as efficiency and ripple and the likes change greatly with layout patterns, which please note carefully. fig.32 pcb layout connect the input bypath capacitor cin(10f) near est to coil l, as shown in the upper diagram. wire the power supply line by the low resistance from cin to vbat pin. and, when it can't be wired by the low resistance, conn ect the input capacitor cbat(1f) nearest to between vbat and gnd pin, as shown in the upper diagram. thereby, the input voltage ripple of the ic can be reduced. connect smoothing capacitor creg of the regulator nearest to between vreg and gnd pin, as shown in the upper diagram. connect schottky barrier diode sbd of the regulator nearest to between coil l and switching transistor tr. and connect output capacitor cout nearest to between cin and g nd pin. thereby, the output vo ltage ripple of the ic can be reduced. connect switching transistor tr nearest to sw pin. wire co il l and switching transistor tr, current sensing resistor r sense by the low resistance. wiring to the sensp pin isn't tr side, but connect it from r sense side. over current value may become low when wiring from tr side. connect r sense of gnd side isolated to sens pin. don?t wire between r sense and snesn pin wiring from snesn pin to gnd pin. after via sensn pin, connect gnd pin, as shown in the upper diagram. connect led current setting resistor riset near est to iset pin. there is possibility to oscillate when capacity is added to iset terminal, so pay attention that capacity isn't added. and, connect riset of gnd side directly to gnd pin. when those pins are not connected direct ly near the chip, influence is given to the performance of bd6066gu/ekn, and may limit the current drive performance. as for the wire to the inductor, make its resistance component small so as to reduce electric power consumption and increase the entire efficiency. the pcb layout in consideration of these is shown in the next page. tr nc gnd nc vreg sw sensp gnd vreg vbat nc en2 nc nc led1 led2 nc led3 led4 nc gnd vdet nc nc iset reset pwm to anode of each led c reg r sense sbd c out c in to cathode of led to gnd to power supply c bat riset pwm en1 sensn test l
technical note 13/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn recommended pcb layout attention point of pcb layout in pcb layout design, the wiring of power supply line should be low impedance, and put the bypass capacitor if necessary. especially the wiring impedance must be lower around the dc/dc converter. about heat loss in heat design, operate the dc/dc conv erter in the following condition. (the following temperature is a guarantee te mperature, so consider the margin.) 1. periphery temperature ta must be less than 85 2. the loss of ic must be less than dissipation pd. fig.33 BD6066EKN component side top view fig.34 BD6066EKN back side top view cin cout l sbd t r rsense riset creg cbat
technical note 14/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn notes for use (1) absolute ma ximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify break ing mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assu med, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characte ristics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take protective measures against the breakdown due to the reverse connection, such as mount ing an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for t he analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the ch aracteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage includi ng an actual electric transient . (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of t he ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to tu rn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establish a ground for the assembly pr ocess and pay thorough attention to the transportation and the stor age of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inev itably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle t he input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to us e a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become 175 (typ) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not continuous ly use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (14) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter.
technical note 15/15 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. bd6066gu,bu6066ekn ordering part number b d 6 0 6 6 g u - e 2 part no. part no. 6066 package gu : vcsp85h2 ekn : hqfn28v packaging and forming specification e2: embossed tape and reel (unit : mm) vcsp85h2 (bd6066gu) s 0.08 s a b ba 0.05 1 2345 a b c d e ( 0.15)index post 1.0max 0.25 0.1 0.3 0.1 1pin mark 2.60 0.1 2.60 0.1 0.3 0.1 p=0.5 4 p=0.5 4 17- 0.3 0.05 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) hqfn28v 0.05 m (1.1) 15 28 22 1 7 8 14 21 5.20.1 5.00.1 5.20.1 5.00.1 0.220.05 0.05 0.95max 0.02 +0.03 - 0.02 0.220.05 3-(0.35) (0.5) (0.22) 0.5 (3.1) (3.1) 0.6 +0.1 - 0.3 notice : do not use the dotted line area for soldering ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.

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